Development of a structural solution to ensure the thermal regime of printed circuit board under space vacuum conditions
Аuthors
,
e-mail: a.rubtsov@avecs.ru
Abstract
This paper presents the development of a structural design solution for a multilayer printed circuit board intended for operation as part of electronic equipment for aerospace applications. The considered printed circuit board incorporates high-power electronic components whose reliable operation requires the maintenance of a stable and controlled thermal regime under conditions of increased power dissipation and limited heat removal capabilities. To improve the thermal operating conditions of power electronic components, a metallic core made of an aluminum–magnesium alloy is integrated into the board structure. The core performs the function of a local heat sink, providing an efficient thermal path for heat removal from areas with the highest heat generation.
A detailed mathematical modeling of thermal processes was carried out to evaluate the temperature distribution across the printed circuit board and to assess the influence of the integrated metallic core on the reduction of the operating temperature of power components. The numerical simulation results demonstrated a significant decrease in the maximum temperature of power electronic components exceeding 25 °C compared to a conventional multilayer printed circuit board without an integrated heat sink. At the same time, the use of a built-in heat sink leads to the formation of a pronounced temperature gradient over the surface of the printed circuit board, which is associated with the localized nature of heat removal from regions with the highest power dissipation.
To validate the numerical modeling results, experimental investigations were conducted under conditions simulating the operational environment of aerospace electronic systems, including vacuum conditions. The experimental data confirmed the effectiveness of the proposed design solution and showed good agreement with the calculated results. The obtained results demonstrate the reliability and thermal stability of the developed printed circuit board design and confirm the feasibility of using integrated metallic cores made of aluminum–magnesium alloys for thermal management in high-power electronic assemblies. The proposed approach can be effectively applied in the development of electronic equipment for aerospace systems, where stringent requirements are imposed on thermal performance, reliability, and mass–dimensional characteristics.
Keywords:
printed circuit board; thermal modeling; heat dissipation; space vacuum; AMg2-M; thermal regime.References
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