Analysis of factors affecting electrochemical migration intensity

Аuthors

Sokolsky A. M.^*, Sokolsky M. L.^**

Moscow Aviation Institute (National Research University), 4, Volokolamskoe shosse, Moscow, А-80, GSP-3, 125993, Russia

*e-mail: sokol347@gmail.com
**e-mail: mikky63@yandex.ru

Abstract

Ensuring highly moisture protection is one of the main factors of avionics reliability improvement. However, since it is impossible to ensure absolute moisture protection, moisture is accumulated among connecting links. Notwithstanding that moisture is purified from admixtures, conducting electric current, while passing through moisture-proofing material, it reacts with salts, alkalis and acids, used for PCB production and left on its surface after clearing operations. A medium propitious for electro migration process develops. As a result, it leads to short circuit inception with subsequent failure of onboard equipment.

Electro migration mechanism consists in creation a potential difference between loaded conductors, which forces positively charged metal ions of a conductor with higher potential to precipitate on the conductor with lower potential. It causes the growth of parasitic interconnections, i. e. dendrites.

Electro migration results in short circuit, which may be followed by equipment overheating, and further lead to inflammation onboard a aircraft.

The main factors affecting electrochemical migration phenomenon intensity are as follows: potential difference between conductors, ambient temperature and relative humidity (as a condition for condensate formation).

Keywords:

avionics, electrochemical processes, failures, physical reliability, electrical design

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